Description
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Sale!
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Original price was: $150.00.$37.50Current price is: $37.50.
Related products
-
Sale!
OpenSCAD Basics Tutorial
Original price was: $15.00.$4.50Current price is: $4.50. Add to cart -
Sale!
What Is AI?: Benefits, Risks, Regulation, Litigation, and Potential Impact on the Labor Market
Original price was: $25.99.$7.79Current price is: $7.79. Add to cart -
Sale!
A Systematic Approach to Lith-Ion Batt
Original price was: $149.00.$37.25Current price is: $37.25. Add to cart -
Sale!
How to Fight a Data Center: A Citizen’s Guide to Data Center Deals
Original price was: $16.99.$5.09Current price is: $5.09. Add to cart
Reviews
There are no reviews yet.